High-performance copper deposition engineered for excellent levelling, adhesion, conductivity and reliable coverage across demanding industrial components.
Surface Engineering
Consistent Copper Deposition
5–30
Micron Range
>90%
IACS Conductivity
ASTM
B734 Standard
Multi
Stage Process
Cyanide copper plating provides excellent levelling, ductility and coverage. It is widely used as a strike layer before nickel and chrome plating and can also provide a durable, conductive finish for selected architectural and electrical applications.
Our controlled process is designed to deliver reliable adhesion, uniform deposition and repeatable results across different component geometries.
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Engineered to support demanding finishing requirements where adhesion, conductivity and surface quality matter.
Helps smooth minor surface imperfections and creates a superior foundation for subsequent finishes.
Provides a reliable copper foundation for nickel, chrome and multi-layer plating systems.
Suitable for applications where dependable electrical conductivity and surface performance are required.
Controlled deposition supports consistent coverage across complex and recessed component geometries.
Alkaline cleaning and acid activation prepare the substrate for effective copper deposition.
A controlled strike layer is applied to maximise adhesion between the base metal and copper.
Copper thickness is progressively built up according to the required specification.
Components undergo rinsing, inspection and thickness verification before release.
Architectural Hardware
Electrical Components
Multi-Stage Plating
General Engineering
Share your drawings, component specifications, quantities and finishing requirements. Our team can help determine the appropriate plating process for your application.
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